Positive photosensitive resin composition and dpolyhydroxyamide resin

ABSTRACT

There is provided a positive photosensitive resin composition that is excellent in electric insulating properties, heat resistance, mechanical strength and electrical characteristics, and capable of forming a high-resolution circuit pattern. The positive photosensitive resin composition comprises at least one type of a polyhydroxyamide resin containing a repeating unit represented by Formula (1) and having a weight average molecular weight of 3,000 to 100,000, and a compound generating an acid by light irradiation. 
     
       
         
         
             
             
         
       
     
     (where X represents a tetravalent aliphatic group or an aromatic group; R 1  and R 2  independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atom(s); Ar 1  and Ar 2  independently represent an aromatic group; Y represents an organic group containing an aromatic group substituted with at least one OH group;
 
n represents an integer of 1 or more; and l and m independently represent an integer of 0 or 1 or more and satisfy l+m≦2).

TECHNICAL FIELD

The present invention relates to a positive photosensitive resincomposition containing a polyhydroxyamide resin and a compoundgenerating an acid by light irradiation, and the polyhydroxyamide resin.This resin composition is suitably utilized as a protecting film, aninsulating film or the like for a semiconductor or a circuit board suchas a printed board.

BACKGROUND ART

Application of a photosensitive resin insulating film produced from aphotosensitive resin represented by a photosensitive polyimide resinhaving excellent mechanical properties and high heat resistance has beenexpanding, and starts to be spread not only in a semiconductor field butalso in a display field, so that reliability on an insulating film whichhas never been required until today is required.

At present, many of positive photosensitive resin compositions used areproduced by adding a photosensitive dissolution inhibitor(diazonaphthoquinone: DNQ) to a base material polymer. A positivepattern can be obtained by producing a coating film from this resincomposition, followed by exposing the film to light through a mask, anddissolving the exposed part in tetramethylammoniumhydroxide (TMAH) whichis a representative water-soluble alkaline developer.

Since a representative polyimide-based positive photosensitive resincomposition has an excessively high solubility in TMAH, such a method isadopted that by reducing the acidity of a polyamide acid using a basicorganic compound such as triethylamine, the dissolving rate of thecomposition in an alkaline developer is suppressed (Patent Document 1).

On the other hand, it is disclosed that since a polyhydroxyamide resinhas an adequate solubility in TMAH, the resin is capable of beingsuitably utilized as a positive photosensitive resin composition (forexample, Patent Document 2).

Examples of properties required to a positive photosensitive resincomposition using a polyhydroxyamide resin include having film physicalproperties excellent in electric insulating properties, heat resistance,mechanical strength and the like, and being capable of forming ahigh-resolution circuit pattern. Recently, requirements for propertiesof these positive photosensitive resin compositions have become morerigid than ever.

Generally, a polyhydroxyamide resin is synthesized using a dicarboxylicacid chloride and dihydroxyamine under a basic condition (Non-patentDocument 1). However, by this method, since inorganic ions such aschloride ions are present in the reaction solution, a polymer needs tobe isolated and purified after the completion of the reaction. Inaddition, since inorganic ions are mixed in the positive photosensitiveresin composition obtained, there is a problem that the inorganic ionscause corrosion when the positive photosensitive resin composition isused in an electronic material field.

For solving such a problem, there is disclosed a method for synthesizinga polyhydroxyamide using as a dicarboxylic acid component, adicarboxylic acid derivative obtained from a reaction of1-hydroxybenzotriazol with a dicarboxylic acid (Patent Document 3).However, since a leaving group derived from the dicarboxylic acidderivative is mixed in the reaction solution, a process for removing theleaving group becomes required, so that it is difficult to obtain ahigh-purity polyhydroxyamide.

On the other hand, there is also disclosed that a polyhydroxyamide resinsynthesized from a coumarin dimer and a diamine is utilized as anegative photosensitive material (Patent Document 4).

However, until now, there has been no reported example for a compositioncontaining a polyhydroxyamide resin and a compound generating an acid bylight irradiation.

[Patent Document 1]

Japanese Patent Application Publication No. JP-A-62-135824

[Patent Document 2]

Japanese Patent Application Publication No. JP-A-2003-302761

[Patent Document 3]

Japanese Patent Application Publication No. JP-A-9-183846

[Patent Document 4]

Japanese Patent Application Publication No. JP-A-58-55926

[Non-patent Document 1]

Polymer Letter., Vol. 2, pp. 655-659 (1964)

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

In order to solve the problems described above, it is an object of thepresent invention to provide a positive photosensitive resin compositionthat is excellent in electric insulating properties, heat resistance,mechanical strength and electrical characteristics, and capable offorming a high-resolution circuit pattern.

In addition, it is another object of the present invention to provide apositive photosensitive resin that contains no chloride, low moleculecompound or the like adversely affecting a semiconductor element, anelectronic/electric circuit or the like, and can be simply synthesized.

Means for Solving the Problems

As a result of assiduous research intended to achieve the objects asdescribed above, the present inventors found that a compositioncontaining a polyhydroxyamide resin having a specific structure shown asfollows (for example, a polyhydroxyamide resin synthesized from acoumarin dimer and a diamine having an aromatic group substituted withat least one OH group) and a compound generating an acid by lightirradiation exhibits film physical properties excellent in terms ofelectric insulating properties, heat resistance, mechanical strength andthe like. Furthermore, the present inventors found that when thecomposition is patterned as a positive photosensitive resin composition,a high-resolution circuit pattern can be formed, and completed thepresent invention.

That is, according to a first aspect of the present invention, apositive photosensitive resin composition is characterized bycontaining: at least one type of a polyhydroxyamide resin (A) containinga repeating unit represented by Formula (1):

(where X represents a tetravalent aliphatic group or an aromatic group;R¹ and R² independently represent a hydrogen atom or an alkyl grouphaving 1 to 10 carbon atom(s); Ar¹ and Ar² independently represent anaromatic group; Y represents an organic group containing an aromaticgroup substituted with at least one OH group; n represents an integer of1 or more; and 1 and m independently represent an integer of 0 or 1 ormore and satisfy 1+m≦2),and having a weight average molecular weight of 3,000 to 100,000; and acompound (B) generating an acid by light irradiation.

According to a second aspect, in the positive photosensitive resincomposition according to the first aspect, the X represents an aliphaticgroup.

According to a third aspect, in the positive photosensitive resincomposition according to the second aspect, the X represents analiphatic group having a cyclic structure.

According to a fourth aspect, in the positive photosensitive resincomposition according to any one of the first aspect to the thirdaspect, in the X, an X—Ar¹ bond and an X—C(O) bond are each bonded to anadjecent atom in the X, and an X—Ar² bond and another X—C(O) bond areeach bonded to an adjacent atom in the X.

According to a fifth aspect, in the positive photosensitive resincomposition according to the fourth aspect, in Formula (1), a group:

has a structure represented by Formula (2):

(where Ar¹, Ar², Y, 1 and m represent the same meaning as defined above;and R³ to R⁶ independently represent a hydrogen atom or an alkyl grouphaving 1 to 10 carbon atom(s)).

According to a sixth aspect, in the positive photosensitive resincomposition according to any one of the first aspect to the fifthaspect, the Ar¹ and the Ar² independently represent a benzene ring.

According to a seventh aspect, in the positive photosensitive resincomposition according to the sixth aspect, the —Ar¹(OH)_(l) group andthe —Ar²(OH)_(m) group have a structure represented by Formula (3):

(where R⁷ to R¹⁰ independently represent a hydrogen atom, an alkyl grouphaving 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbonatom(s), an alkoxy group having 1 to 10 carbon atom(s), a halogen atom,a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W¹, a naphthyl group which may be substituted with W¹,a thienyl group which may be substituted with W¹ or a furyl group whichmay be substituted with W¹; and W¹ represents an alkyl group having 1 to10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), analkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogenatom, a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group or a sulfonyl group).

According to an eighth aspect, in the positive photosensitive resincomposition according to any one of the first aspect to the seventhaspect, the Y represents an organic group containing a benzene ringsubstituted with at least one OH group.

According to a ninth aspect, in the positive photosensitive resincomposition according to the eighth aspect, the Y represents an organicgroup containing two or more benzene rings substituted with at least oneOH group.

According to a tenth aspect, in the positive photosensitive resincomposition according to the ninth aspect, the Y has a structurerepresented by Formula (4):

(where R¹¹ to R¹⁶ independently represent a hydrogen atom, an alkylgroup having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a hydroxygroup, a halogen atom, a nitro group, a formyl group, a cyano group, acarboxyl group, a phosphonyl group, a sulfonyl group, a phenyl groupwhich may be substituted with W², a naphthyl group which may besubstituted with W², a thienyl group which may be substituted with W² ora furyl group which may be substituted with W²; W² represents an alkylgroup having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a hydroxygroup, a halogen atom, a nitro group, a formyl group, a cyano group, acarboxyl group, a phosphonyl group or a sulfonyl group; Z¹ represents asingle bond, an alkylene group having 1 to 10 carbon atom(s) which maybe substituted with W³, —C(O)O—, —C(O)NH—, —O—, —S—, —S(O)₂— or —C(O)—;and W³ represents an alkyl group having 1 to 10 carbon atom(s), ahaloalkyl group having 1 to 10 carbon atom(s) or an alkoxy group having1 to 10 carbon atom(s)).

According to an eleventh aspect, in the positive photosensitive resincomposition according to the tenth aspect, the Z¹ represents a singlebond, —CH₂—, —C(CH₃)₂—, —C(CF₃)₂—, —C(O)NH—, —O—, —S(O)₂— or —C(O)—.

According to a twelfth aspect, in the positive photosensitive resincomposition according to any one of the first aspect to the eleventhaspect, the polyhydroxyamide resin (A) further contains at least onetype of a repeating unit represented by Formula (5):

(where X, Ar¹, Ar², R¹, R², l and m represent the same meaning asdefined above; Q represents a divalent organic group (with a provisothat the group contains no OH group); and p represents an integer of 1or more).

According to a thirteenth aspect, in the positive photosensitive resincomposition according to the twelfth aspect, the Q represents an organicgroup containing an aromatic group.

According to a fourteenth aspect, in the positive photosensitive resincomposition according to the thirteenth aspect, the Q represents anorganic group containing a benzene ring.

According to a fifteenth aspect, in the positive photosensitive resincomposition according to the fourteenth aspect, the Q represents anorganic group containing two or more benzene rings.

According to a sixteenth aspect, in the positive photosensitive resincomposition according to the fifteenth aspect, the Q represents anorganic group containing at least one repeating unit structure selectedfrom Formula (6) to Formula (8):

(in Formula (6), R¹⁷ to R²⁴ independently represent a hydrogen atom, analkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), ahalogen atom, a nitro group, a formyl group, a cyano group, a carboxylgroup, a phosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W⁴, a naphthyl group which may be substituted with W⁴,a thienyl group which may be substituted with W⁴ or a furyl group whichmay be substituted with W⁴; and W⁴ represents an alkyl group having 1 to10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), analkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogenatom, a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group or a sulfonyl group, in Formula (7) and Formula (8),R²⁵ to R⁵¹ independently represent a hydrogen atom, an alkyl grouphaving 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbonatom(s), an alkoxy group having 1 to 10 carbon atom(s), a halogen atom,a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W⁴, a naphthyl group which may be substituted with W⁴,a thienyl group which may be substituted with W⁴ or a furyl group whichmay be substituted with W⁴; and W⁴ represents the same meaning asdefined above, and in Formula (6) to Formula (8), Z² to Z⁷ independentlyrepresent a single bond, an alkylene group having 1 to 10 carbon atom(s)which may be substituted with W⁵, —C(O)O—, —C(O)NH—, —O—, —S—, —S(O)₂—or —C(O)—; and W⁵ represents an alkyl group having 1 to 10 carbonatom(s), a haloalkyl group having 1 to 10 carbon atom(s) or an alkoxygroup having 1 to 10 carbon atom(s)).

According to a seventeenth aspect, in the positive photosensitive resincomposition according to the sixteenth aspect, in Formula (6) to Formula(8), Z² to Z⁷ independently represent an alkylene group having 1 to 3carbon atom(s), —O—, —S—, —S(O)₂— or —C(O)—.

According to an eighteenth aspect, in the positive photosensitive resincomposition according to the seventeenth aspect, in Formula (6), Z²represents —O—.

According to a nineteenth aspect, in the positive photosensitive resincomposition according to the seventeenth aspect, in Formula (7), Z³ andZ⁴ represent —O—.

According to a 20th aspect, in the positive photosensitive resincomposition according to the seventeenth aspect, in Formula (8), Z⁵ andZ⁷ represent —O— and Z⁶ represents —S(O)₂—.

According to a 21st aspect, in the positive photosensitive resincomposition according to any one of the first aspect to the 20th aspect,the polyhydroxyamide resin (A) further contains at least one type of arepeating unit represented by Formula (9):

(where X, Ar¹, Ar², R¹, R², l and m represent the same meaning asdefined above; R⁵² to R⁵⁶ independently represent a hydrogen atom, analkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), ahalogen atom, a nitro group, a formyl group, a cyano group, a carboxylgroup, a phosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W⁶, a naphthyl group which may be substituted with W⁶,a thienyl group which may be substituted with W⁶ or a furyl group whichmay be substituted with W⁶; W⁶ represents an alkyl group having 1 to 10carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), analkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogenatom, a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group or a sulfonyl group; Z⁸ to Z¹⁰ independently representa single bond, an alkylene group having 1 to 10 carbon atom(s) which maybe substituted with W⁷, —C(O)O—, —C(O)NH—, —O—, —S—, —S(O)₂— or —C(O)—;W⁷ represents an alkyl group having 1 to 10 carbon atom(s), a haloalkylgroup having 1 to 10 carbon atom(s) or an alkoxy group having 1 to 10carbon atom(s); and q represents an integer of 1 or more).

According to a 22nd aspect, in the positive photosensitive resincomposition according to the 21st aspect, in Formula (9), Z⁸ to Z¹⁰independently represent an alkylene group having 1 to 3 carbon atom(s),—O—, —S—, —S(O)₂— or —C(O)—.

According to a 23rd aspect, in the positive photosensitive resincomposition according to the 22nd aspect, in Formula (9), Z⁸ and Z¹⁰represent a propylene group and Z⁹ represents —O—.

According to a 24th aspect, in the positive photosensitive resincomposition according to any one of the first aspect to the 23rd aspect,0.01 to 100 parts by mass of the compound (B) generating an acid bylight irradiation is contained based on 100 parts by mass of thepolyhydroxyamide resin (A).

According to a 25th aspect, the positive photosensitive resincomposition according to any one of the first aspect to the 24th aspectfurther contains a crosslinkable compound (C).

According to a 26th aspect, in the positive photosensitive resincomposition according to the 25th aspect, 30 to 120 parts by mass of thecrosslinkable compound (C) is contained based on 100 parts by mass ofthe polyhydroxyamide resin (A).

According to a 27th aspect, a positive photosensitive resincomposition-containing varnish is characterized in that the positivephotosensitive resin composition as described in any one of the firstaspect to the 26th aspect is dissolved in at least one type of asolvent.

According to a 28th aspect, a cured film is produced by using thepositive photosensitive resin composition as described in any one of thefirst aspect to the 26th aspect.

According to a 29th aspect, a cured film is produced by using thepositive photosensitive resin composition-containing varnish asdescribed in the 27th aspect.

According to a 30th aspect, a structure includes at least one layerformed by the cured film as described in the 28th aspect or the 29thaspect on a substrate.

According to a 31st aspect, a polyhydroxyamide resin contains arepeating unit represented by Formula (10):

(where X represents a tetravalent aliphatic group or an aromatic group;R¹ and R² independently represent a hydrogen atom or an alkyl grouphaving 1 to 10 carbon atom(s); Ar¹ and Ar² independently represent anaromatic group; Y represents an organic group containing an aromaticgroup substituted with at least one OH group; n represents an integer of1 or more; and l and m independently represent an integer of 0 or 1 ormore and satisfy l+m≦2), and has a weight average molecular weight of3,000 to 100,000.

According to a 32nd aspect, in the polyhydroxyamide resin according tothe 31st aspect, the X represents an aliphatic group.

According to a 33rd aspect, in the polyhydroxyamide resin according tothe 32nd aspect, the X represents an aliphatic group having a cyclicstructure. According to a 34th aspect, in the polyhydroxyamide resinaccording to any one of the 31st aspect to the 33rd aspect, in the X, anX—Ar¹ bond and an X—C(O) bond are each bonded to an adjacent atom in theX, and an X—Ar² bond and another X—C(O) bond are each bonded to anadjacent atom in the X.

According to a 35th aspect, in the polyhydroxyamide resin according tothe 34th aspect, in Formula (10), a group:

has a structure represented by Formula (11):

(where Ar¹, Ar², Y, l and m represent the same meaning as defined above;and R³ to R⁶ independently represent a hydrogen atom or an alkyl grouphaving 1 to 10 carbon atom(s)).

According to a 36th aspect, in the polyhydroxyamide resin according toany one of the 31st aspect to the 35th aspect, the Ar¹ and the Ar²independently represent a benzene ring.

According to a 37th aspect, in the polyhydroxyamide resin according tothe 36th aspect, the —Ar¹(OH)_(l) group and the —Ar²(OH)_(m) group havea structure represented by Formula (12):

(where R⁷ to R¹⁰ independently represent a hydrogen atom, an alkyl grouphaving 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbonatom(s), an alkoxy group having 1 to 10 carbon atom(s), a halogen atom,a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W¹, a naphthyl group which may be substituted with W¹,a thienyl group which may be substituted with W¹ or a furyl group whichmay be substituted with W¹; and W¹ represents an alkyl group having 1 to10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), analkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogenatom, a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group or a sulfonyl group).

According to a 38th aspect, in the polyhydroxyamide resin according toany one of the 31st aspect to the 37th aspect, the Y represents anorganic group containing a benzene ring substituted with at least one OHgroup.

According to a 39th aspect, in the polyhydroxyamide resin according tothe 38th aspect, the Y represents an organic group containing two ormore benzene rings substituted with at least one OH group.

According to a 40th aspect, in the polyhydroxyamide resin according tothe 39th aspect, the Y has a structure represented by Formula (13):

(where R¹¹ to R¹⁶ independently represent a hydrogen atom, an alkylgroup having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a hydroxygroup, a halogen atom, a nitro group, a formyl group, a cyano group, acarboxyl group, a phosphonyl group, a sulfonyl group, a phenyl groupwhich may be substituted with W², a naphthyl group which may besubstituted with W², a thienyl group which may be substituted with W² ora furyl group which may be substituted with W²; W² represents an alkylgroup having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a hydroxygroup, a halogen atom, a nitro group, a formyl group, a cyano group, acarboxyl group, a phosphonyl group or a sulfonyl group; Z¹ represents asingle bond, an alkylene group having 1 to 10 carbon atom(s) which maybe substituted with W³, —C(O)O—, —C(O)NH—, —O—, —S—, —S(O)₂— or —C(O)—;and W³ represents an alkyl group having 1 to 10 carbon atom(s), ahaloalkyl group having 1 to 10 carbon atom(s) or an alkoxy group having1 to 10 carbon atom(s)).

According to a 41st aspect, in the polyhydroxyamide resin according tothe 40th aspect, the Z¹ represents a single bond, —CH₂—, —C(CH₃)₂—,—C(CF₃)₂—, —C(O)NH—, —O—, —S(O)₂— or —C(O)—.

According to a 42nd aspect, in the polyhydroxyamide resin according toany one of the 31st aspect to the 41st aspect, the polyhydroxyamideresin (A) further contains at least one type of a repeating unitrepresented by Formula (14):

(where X, Ar¹, Ar², R¹, R², l and m represent the same meaning asdefined above; and represents-valent aliphatic group or an aromaticgroup; Q represents a divalent organic group (with a proviso that thegroup contains no OH group); and p represents an integer of 1 or more).

According to a 43rd aspect, in the polyhydroxyamide resin according tothe 42nd aspect, the Q represents an organic group containing anaromatic group.

According to a 44th aspect, in the polyhydroxyamide resin according tothe 43rd aspect, the Q represents an organic group containing a benzenering.

According to a 45th aspect, in the polyhydroxyamide resin according tothe 44th aspect, the Q represents an organic group containing two ormore benzene rings.

According to a 46th aspect, in the polyhydroxyamide resin according tothe 45th aspect, the Q represents an organic group containing at leastone repeating unit structure selected from Formula (15) to Formula (17):

(in Formula (15), R¹⁷ to R²⁴ independently represent a hydrogen atom, analkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), ahalogen atom, a nitro group, a formyl group, a cyano group, a carboxylgroup, a phosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W⁴, a naphthyl group which may be substituted with W⁴,a thienyl group which may be substituted with W⁴ or a furyl group whichmay be substituted with W⁴; and W⁴ represents an alkyl group having 1 to10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), analkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogenatom, a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group or a sulfonyl group, in Formula (16) and Formula (17),R²⁵ to R⁵¹ independently represent a hydrogen atom, an alkyl grouphaving 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbonatom(s), an alkoxy group having 1 to 10 carbon atom(s), a halogen atom,a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W⁴, a naphthyl group which may be substituted with W⁴,a thienyl group which may be substituted with W⁴ or a furyl group whichmay be substituted with W⁴; and W⁴ represents the same meaning asdefined above, and in Formula (15) to Formula (17), Z² to Z⁷independently represent a single bond, an alkylene group having 1 to 10carbon atom(s) which may be substituted with W⁵, —C(O)O—, —C(O)NH—, —O—,—S—, —S(O)₂— or —C(O)—; and W⁵ represents an alkyl group having 1 to 10carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s) or analkoxy group having 1 to 10 carbon atom(s)).

According to a 47th aspect, in the polyhydroxyamide resin according tothe 46th aspect, in Formula (15) to Formula (17), Z² to Z⁷ independentlyrepresent an alkylene group having 1 to 3 carbon atom(s), —O—, —S—,—S(O)₂— or —C(O)—.

According to a 48th aspect, in the polyhydroxyamide resin according tothe 47th aspect, in Formula (15), Z² represents —O—.

According to a 49th aspect, in the polyhydroxyamide resin according tothe 47th aspect, in Formula (16), Z³ and Z⁴ represent —O—.

According to a 50th aspect, in the polyhydroxyamide resin according tothe 47th aspect, in Formula (17), Z⁵ and Z⁷ represent —O— and Z⁶represents —S(O)₂—.

According to a 51st aspect, in the polyhydroxyamide resin according toany one of the 31st aspect to the 50th aspect, the polyhydroxyamideresin (A) further contains at least one type of a repeating unitrepresented by Formula (18):

(where X, Ar¹, Ar², R¹, R², l and m represent the same meaning asdefined above; R⁵² to R⁵⁶ independently represent a hydrogen atom, analkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), ahalogen atom, a nitro group, a formyl group, a cyano group, a carboxylgroup, a phosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W⁶, a naphthyl group which may be substituted with W⁶,a thienyl group which may be substituted with W⁶ or a furyl group whichmay be substituted with W⁶; W⁶ represents an alkyl group having 1 to 10carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), analkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogenatom, a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group or a sulfonyl group; Z⁸ to Z¹⁰ independently representa single bond, an alkylene group having 1 to 10 carbon atom(s) which maybe substituted with W⁷, —C(O)O—, —C(O)NH—, —O—, —S—, —S(O)₂— or —C(O)—;W⁷ represents an alkyl group having 1 to 10 carbon atom(s), a haloalkylgroup having 1 to 10 carbon atom(s) or an alkoxy group having 1 to 10carbon atom(s); and q represents an integer of 1 or more).

According to a 52nd aspect, in the polyhydroxyamide resin according tothe 51st aspect, in Formula (18), Z⁸ to Z¹⁰ independently represent analkylene group having 1 to 3 carbon atom(s), —O—, —S—, —S(O)₂— or—C(O)—.

According to a 53rd aspect, in the polyhydroxyamide resin according tothe 52nd aspect, in Formula (18), Z⁸ and Z¹⁰ represent a propylene groupand Z⁹ represents —O—.

EFFECTS OF THE INVENTION

The positive photosensitive resin composition of the present inventioncan produce a cured film excellent in electric insulating properties,heat resistance, mechanical strength and electrical characteristics.

Furthermore, a high-resolution circuit pattern can be formed by exposingthe positive photosensitive resin composition of the present inventionapplied on a substrate to light using a specified pattern mask and thenby developing the resultant pattern with an alkaline developer.

A cured film produced using the positive photosensitive resincomposition of the present invention is useful as a protecting film andan insulating film for a semiconductor and a circuit board such as aprinted board, and is particularly suitable for a protecting film and aninsulating film for a semiconductor.

In addition, the positive photosensitive resin of the present inventioncan be simply and easily synthesized and contains no chloride, lowmolecule compound or the like affecting adversely a semiconductorelement, an electronic/electric circuit or the like, so that the resincan be used as the positive photosensitive resin composition of thepresent invention without purifying the resin.

BEST MODES FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention will be described more in detail.

The positive photosensitive resin composition according to the presentinvention contains at least one type of a polyhydroxyamide resin (A)containing a repeating unit represented by Formula (1) and having aweight average molecular weight of 3,000 to 100,000, and a compound (B)generating an acid by light irradiation.

In addition, the polyhydroxyamide resin (A) is also in the scope of thepresent invention.

(Polyhydroxyamide Resin (A))

The polyhydroxyamide resin (A) used in the present invention containsthe repeating unit represented by Formula (1):

(where X represents a tetravalent aliphatic group or an aromatic group;R¹ and R² independently represent a hydrogen atom or an alkyl grouphaving 1 to 10 carbon atom(s); Ar¹ and Ar² independently represent anaromatic group; Y represents an organic group containing an aromaticgroup substituted with at least one OH group; n represents an integer of1 or more; and l and m independently represent an integer of 0 or 1 ormore and satisfy l+m≦2).

In Formula (1), X is preferably an aliphatic group, more preferably analiphatic group having a cyclic structure in particular.

In addition, it is preferred that in the X, an X—Ar¹ bond and an X—C(O)bond be each individually bonded to an adjacent atom in the X, and anX—Ar² bond and another X—C(O) bond be each bonded to an adjacent atom inthe X.

Specific examples of a group:

containing the X include groups having a structure represented byFormula (2):

(where Ar¹, Ar², Y, l and m represent the same meaning as defined above;and R³ to R⁶ independently represent a hydrogen atom or an alkyl grouphaving 1 to 10 carbon atom(s)).

It is preferred that in Formula (1), Ar¹ and Ar² independently representa benzene ring and specific examples of the —Ar¹(OH)_(l) groupcontaining Ar¹ and the —Ar²(OH)_(m) group containing Ar² include groupshaving a structure represented by Formula (3):

(where R⁷ to R¹⁰ independently represent a hydrogen atom, an alkyl grouphaving 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbonatom(s), an alkoxy group having 1 to 10 carbon atom(s), a halogen atom,a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W¹, a naphthyl group which may be substituted with W¹,a thienyl group which may be substituted with W¹ or a furyl group whichmay be substituted with W¹; and W¹ represents an alkyl group having 1 to10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), analkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogenatom, a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group or a sulfonyl group).

In Formula (1), it is preferred that Y be an organic group containing abenzene ring substituted with at least one OH group and it is morepreferred that Y be particularly an organic group containing two or morebenzene rings substituted with at least one OH group.

Examples of the Y include groups having a structure represented byFormula (4):

(where R¹¹ to R¹⁶ independently represent a hydrogen atom, an alkylgroup having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a hydroxygroup, a halogen atom, a nitro group, a formyl group, a cyano group, acarboxyl group, a phosphonyl group, a sulfonyl group, a phenyl groupwhich may be substituted with W², a naphthyl group which may besubstituted with W², a thienyl group which may be substituted with W² ora furyl group which may be substituted with W²; W² represents an alkylgroup having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a hydroxygroup, a halogen atom, a nitro group, a formyl group, a cyano group, acarboxyl group, a phosphonyl group or a sulfonyl group; Z¹ represents asingle bond, an alkylene group having 1 to 10 carbon atom(s) which maybe substituted with W³, —C(O)O—, —C(O)NH—, —O—, —S—, —S(O)₂— or —C(O)—;and W³ represents an alkyl group having 1 to 10 carbon atom(s), ahaloalkyl group having 1 to 10 carbon atom(s) or an alkoxy group having1 to 10 carbon atom(s)).

It is desired that in Formula (4), the Z¹ is a single bond, —CH₂—,—C(CH₃)₂—, —C(CF₃)₂—, —C(O)NH—, —O—, —S(O)₂— or —C(O)—.

Specific examples of the compound having a structure represented byFormula (4) include 4,4′-dihydroxybenzidine (3BP),3,3′-diamino-4,4′-dihydroxybiphenyl (4BP),3,3′-diamino-2,2′-dihydroxybiphenyl (2BP),2,2′-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHF),2,2-bis(4-amino-3,5-dihydroxyphenyl) hexafluoropropane,2,2-bis(4-(3-amino-4-hydroxyphenoxy)phenyl) hexafluoropropane,bis(3-amino-4-hydroxyphenyl)methane (BAPF),3,3′-diamino-4,4′-dihydroxybenzophenone (AHPK),3,3′-diamino-4,4′-dihydroxy-phenyl ether (AHPE),3,3′-diamino-4,4′-dihydroxy-thiophenyl ether,2,2′-bis(3-amino-4-hydroxyphenyl)propane (BAPA),(3-amino-4-hydroxy)phenyl (3-amino-4-hydroxy) anilide (AHPA),bis(3-amino-4-hydroxyphenyl)sulfone (BSDA),(4-(4-aminophenoxy)phenyl)sulfone, 2,4-diaminophenol, 3,5-diaminophenol,2,5-diaminophenol, 4,6-diaminoresorcinol, 2,5-diaminohydroquinone,bis(3-amino-4-hydroxyphenyl)thioether,bis(4-amino-3,5-dihydroxyphenyl)thioether,bis(3-amino-4-hydroxyphenyl)ether,bis(4-amino-3,5-dihydroxyphenyl)ether,bis(3-amino-4-hydroxyphenyl)methane,bis(4-amino-3,5-dihydroxyphenyl)methane,bis(3-amino-4-hydroxyphenyl)sulfone,bis(4-amino-3,5-dihydroxyphenyl)sulfone,4,4′-diamino-3,3′-dihydroxybiphenyl,4,4′-diamino-3,3′-dihydroxy-5,5′-dimethylbiphenyl,4,4′-diamino-3,3′-dihydroxy-5,5′-dimethoxybiphenyl,1,4-bis(3-amino-4-hydroxyphenoxy)benzene,1,3-bis(3-amino-4-hydroxyphenoxy)benzene,1,4-bis(4-amino-3-hydroxyphenoxy)benzene,1,3-bis(4-amino-3-hydroxyphenoxy)benzene,bis(4-(3-amino-4-hydroxyphenoxy)phenyl)sulfone,bis(4-(3-amino-4-hydroxyphenoxy)phenyl)propane or1,4-bis(4-aminophenoxy)benzene. However, the present invention is notlimited to these examples.

In addition, the polyhydroxyamide resin of the present invention maycontain, besides the repeating unit represented by Formula (1), arepeating unit represented by Formula (5):

(where X, Ar¹, Ar², R¹, R², l and m represent the same meaning asdefined above; Q represents a divalent organic group (with a provisothat the group contains no OH group); and p represents an integer of 1or more).

In Formula (5), it is desired that Q is an aromatic group, particularlyan organic group containing a benzene ring, preferably an organic groupcontaining two or more benzene rings.

Examples of the Q include groups having structures represented byFormula (6) to Formula (8):

(in Formula (6), R¹⁷ to R²⁴ independently represent a hydrogen atom, analkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), ahalogen atom, a nitro group, a formyl group, a cyano group, a carboxylgroup, a phosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W⁴, a naphthyl group which may be substituted with W⁴,a thienyl group which may be substituted with W⁴ or a furyl group whichmay be substituted with W⁴; and W⁴ represents an alkyl group having 1 to10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), analkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogenatom, a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group or a sulfonyl group,in Formula (7) and Formula (8), R²⁵ to R⁵¹ independently represent ahydrogen atom, an alkyl group having 1 to 10 carbon atom(s), a haloalkylgroup having 1 to 10 carbon atom(s), an alkoxy group having 1 to 10carbon atom(s), a halogen atom, a nitro group, a formyl group, a cyanogroup, a carboxyl group, a phosphonyl group, a sulfonyl group, a phenylgroup which may be substituted with W⁴, a naphthyl group which may besubstituted with W⁴, a thienyl group which may be substituted with W⁴ ora furyl group which may be substituted with W⁴; and W⁴ represents thesame meaning as defined above, andin Formula (6) to Formula (8), Z² to Z⁷ independently represent a singlebond, an alkylene group having 1 to 10 carbon atom(s) which may besubstituted with W⁵, —C(O)O—, —C(O)NH—, —O—, —S—, —S(O)₂— or —C(O)—; andW⁵ represents an alkyl group having 1 to 10 carbon atom(s), a haloalkylgroup having 1 to 10 carbon atom(s) or an alkoxy group having 1 to 10carbon atom(s)).

It is preferred that in Formula (6) to Formula (8), Z² to Z⁷independently represent an alkylene group having 1 to 3 carbon atom(s),—O—, —S—, —S(O)₂— or —C(O)—. Particularly, it is preferred that Z² to Z⁵or Z⁷ represent —O— and Z⁶ represents —S(O)₂—.

Specific examples of the compound having structures represented byFormula (6) to Formula (8) include: aromatic diamines such as2,2′-bis(trifluoromethyl)benzidine, 3,3′-bis(trifluoromethyl)benzidine,2,6,2′,6′-tetraxis(trifluoromethyl)benzidine, 2,2-bis(4-anilino)hexafluoropropane, 2,2-bis(3-anilino) hexafluoropropane,2-bis(3-amino-4-toluyl) 2,2-bis(4-(4-amino-3-carboxyphenoxy)phenyl)hexafluoropropane, p-phenylenediamine, m-phenylenediamine,2,4,6-trimethyl-1,3-phenylenediamine,2,3,5,6-tetramethyl-1,4-phenylenediamine, 4,4′-diamino diphenyl ether,3,4′-diamino diphenyl ether, 3,3′-diamino diphenyl ether, 4,4′-diaminodiphenyl sulfone, 4,4′-diamino diphenyl methane, 3,4′-diamino diphenylmethane, 3,3′-diamino diphenyl methane,4,4-methylene-bis(2-methylaniline),4,4′-methylene-bis(2,6-dimethylaniline),4,4-methylene-bis(2,6-diethylaniline),4,4′-methylene-bis(2-isopropyl-6-methylaniline),4,4′-methylene-bis(2,6-diisopropylaniline), 4,4′-diamino diphenylsulfone, 3,3′-diamino diphenyl sulfone, benzidine, o-tolidine,m-tolidine, and 3,3′,5,5′-tetramethylbenzidine; diamines having acidicgroups such as 1,3-bis(4-aminophenoxy)benzene, 2,4-diamino benzoic acid,2,5-diamino benzoic acid, 3,5-diamino benzoic acid,4,6-diamino-1,3-benzene dicarboxylic acid, 2,5-diamino-1,4-benzenedicarboxylic acid, bis(4-amino-3-carboxyphenyl)ether,bis(4-amino-3,5-dicarboxyphenyl)ether,bis(4-amino-3-carboxyphenyl)sulfone,bis(4-amino-3,5-dicarboxyphenyl)sulfone,4,4′-diamino-3,3′-dicarboxybiphenyl,4,4′-diamino-3,3′-dicarboxy-5,5′-dimethylbiphenyl,4,4′-diamino-3,3′-dicarboxy-5,5′-dimethoxybiphenyl,1,4-bis(4-amino-3-carboxyphenoxy)benzene,1,3-bis(4-amino-3-carboxyphenoxy)benzene,bis(4-(4-amino-3-carboxyphenoxy)phenyl)sulfone, andbis(4-(4-amino-3-carboxyphenoxy)phenyl); and aliphatic diamines such as1,6-hexanediamine, 1,4-cyclohexanediamine, 1,3-cyclohexanediamine,1,4-bis(aminomethyl)cyclohexane, 1,3-bis(aminomethyl)cyclohexane,4,4′-diaminodicyclohexylmethane and4,4′-diamino-3-3′-dimethyldicyclohexylmethane. However, the presentinvention is not limited to these examples.

Furthermore, the polyhydroxyamide resin of the present invention maycontain, besides the repeating unit represented by Formula (1), arepeating unit represented by Formula (9):

(where X, Ar¹, Ar², R¹, R², l and m represent the same meaning asdefined above; R⁵² to R⁵⁶ independently represent a hydrogen atom, analkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), ahalogen atom, a nitro group, a formyl group, a cyano group, a carboxylgroup, a phosphonyl group, a sulfonyl group, a phenyl group which may besubstituted with W⁶, a naphthyl group which may be substituted with W⁶,a thienyl group which may be substituted with W⁶ or a furyl group whichmay be substituted with W⁶; W⁶ represents an alkyl group having 1 to 10carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), analkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogenatom, a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group or a sulfonyl group; Z⁸ to Z¹⁰ independently representa single bond, an alkylene group having 1 to 10 carbon atom(s) which maybe substituted with W⁷, —C(O)O—, —C(O)NH—, —O—, —S—, —S(O)₂— or —C(O)—;W⁷ represents an alkyl group having 1 to 10 carbon atom(s), a haloalkylgroup having 1 to 10 carbon atom(s) or an alkoxy group having 1 to 10carbon atom(s); and q represents an integer of 1 or more).

It is preferred that in Formula (9), Z⁸ to Z¹⁰ independently representan alkylene group having 1 to 3 carbon atom(s), —O—, —S—, —S(O)₂— or—C(O)—. Particularly, it is more preferred that Z⁸ and Z¹⁰ represent apropylene group and Z⁹ represents —O—.

The polyhydroxyamide resin represented by Formula (1) to be used in thepresent invention can be obtained, for example, by reacting a coumarindimer component with a diamine component.

(Coumarin Dimer Component)

The coumarin dimer component which is a monomer component constitutingthe polyhydroxyamide resin (A) used in the present invention isrepresented by General Formula (19):

(where R⁵⁶, R⁵⁷, R⁵⁸, R⁵⁹, R⁶⁰ and R⁶¹ independently represent an alkylgroup having 1 to 10 carbon atom(s), a halogen atom, a nitro group, anamino group, a cyano group, a carboxy group, an alkoxycarbonyl grouphaving 1 to 10 carbon atom(s), a halogenated alkyl group having 1 to 10carbon atom(s) or a hydroxy group).

(Diamine Component)

The diamine component which is a monomer component constituting thepolyhydroxyamide resin (A) used in the present invention is notparticularly limited so long as it is a diamine containing aromaticgroups substituted with at least one OH group.

Examples of the diamine component include 4,4′-dihydroxybenzidine (3BP),3,3′-diamino-4,4′-dihydroxybiphenyl (4BP),3,3′-diamino-2,2′-dihydroxybiphenyl (2BP),2,2′-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHF),2,2-bis(4-amino-3,5-dihydroxyphenyl)hexafluoropropane,2,2-bis(4-(3-amino-4-hydroxyphenoxy)phenyl)hexafluoropropane,bis(3-amino-4-hydroxyphenyl)methane (BAPF),3,3′-diamino-4,4′-dihydroxybenzophenone (AHPK),3,3′-diamino-4,4′-dihydroxy-phenyl ether (AHPE),3,3′-diamino-4,4′-dihydroxy-thiophenyl ether,2,2′-bis(3-amino-4-hydroxyphenyl)propane (BAPA),(3-amino-4-hydroxy)phenyl (3-amino-4-hydroxy)anilide (AHPA),bis(3-amino-4-hydroxyphenyl)sulfone (BSDA),(4-(4-aminophenoxy)phenyl)sulfone, 2,4-diaminophenol, 3,5-diaminophenol,2,5-diaminophenol, 4,6-diaminoresorcinol, 2,5-diaminohydroquinone,bis(3-amino-4-hydroxyphenyl)thioether,bis(4-amino-3,5-dihydroxyphenyl)thioether,bis(3-amino-4-hydroxyphenyl)ether,bis(4-amino-3,5-dihydroxyphenyl)ether,bis(3-amino-4-hydroxyphenyl)methane,bis(4-amino-3,5-dihydroxyphenyl)methane,bis(3-amino-4-hydroxyphenyl)sulfone,bis(4-amino-3,5-dihydroxyphenyl)sulfone,4,4′-diamino-3,3′-dihydroxybiphenyl,4,4′-diamino-3,3′-dihydroxy-5,5′-dimethylbiphenyl,4,4′-diamino-3,3′-dihydroxy-5,5′-dimethoxybiphenyl,1,4-bis(3-amino-4-hydroxyphenoxy)benzene,1,3-bis(3-amino-4-hydroxyphenoxy)benzene,1,4-bis(4-amino-3-hydroxyphenoxy)benzene,1,3-bis(4-amino-3-hydroxyphenoxy)benzene,bis(4-(3-amino-4-hydroxyphenoxy)phenyl)sulfone,bis(4-(3-amino-4-hydroxyphenoxy)phenyl)propane or1,4-bis(4-aminophenoxy)benzene. However, the present invention is notlimited to these examples.

Among the above diamine components, particularly preferred examplesthereof include bis(3-amino-4-hydroxyphenyl)methane (BAPF),2,2′-bis(3-amino-4-hydroxyphenyl)propane (BAPA),2,2′-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHF),3,3′-diamino-4,4′-dihydroxy-phenyl ether (AHPE),3,3′-diamino-4,4′-dihydroxybenzophenone (AHPK),bis(3-amino-4-hydroxyphenyl)sulfide (BSDA) and (3-amino-4-hydroxy)phenyl(3-amino-4-hydroxy)anilide (AHPA).

In addition, as the diamine component which is a monomer componentconstituting the polyhydroxyamide resin (A) used in the presentinvention, besides the above diamines containing aromatic groupssubstituted with at least one OH group, other diamines can be used.

The other diamines are not particularly limited, however, it is desiredthat the other diamines are preferably diamines containing aromaticgroups, particularly diamines containing one or more benzene ring(s).

Examples of the other diamines which are diamines containing aromaticgroups include p-phenylenediamine, m-phenylenediamine,2,4,6-trimethyl-1,3-phenylenediamine,2,3,5,6-tetramethyl-1,4-phenylenediamine, 4,4′-diaminodiphenylether,3,4′-diaminodiphenylether, 3,3′-diaminodiphenylether,4,4′-diaminodiphenylsulfide, 4,4′-diaminodiphenylmethane,3,4′-diaminodiphenylmethane, 3,3′-diaminodiphenylmethane,4,4-methylene-bis(2-methylaniline),4,4′-methylene-bis(2,6-dimethylaniline),4,4-methylene-bis(2,6-diethylaniline),4,4′-methylene-bis(2-isopropyl-6-methylaniline),4,4′-methylene-bis(2,6-diisopropylaniline), 4,4′-diaminodiphenylsulfone,3,3′-diaminodiphenylsulfone, benzidine, o-tolidine, m-tolidine,3,3′,5,5′-tetramethylbenzidine, 1,4-bis(4-aminophenoxy)benzene,1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene,bis(4-(4-aminophenoxy)phenyl)sulfone,bis(4-(3-aminophenoxy)phenyl)sulfone,2,2-bis(4-(4-aminophenoxy)phenyl)propane or2,2-bis(4-(3-aminophenoxy)phenyl)propane.

Among them, particularly preferred examples include4,4′-diaminodiphenylether (ODA) and 1,3-bis(4-aminophnoxy)benzene(DA4P).

Furthermore, as the diamine component which is a monomer componentconstituting the polyhydroxyamide resin (A) used in the presentinvention, besides the above diamines containing aromatic groupssubstituted with at least one OH group, also diamines containingsiloxane may be used. By using a siloxane-containing diamine in acombination, the adhesion of a coating film containing thepolyhydroxyamide resin (A) to a substrate can be enhanced.

As a preferred example of the siloxane-containing diamine,siloxane-containing diamines represented by Formula (20):

(where R⁶² represents a divalent organic group; R⁶³ independentlyrepresent a monovalent organic group; and k represents an integer of 1or more) are preferred and among them,bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane (APDS) is morepreferred.

The polyhydroxyamide resin (A) used in the present invention is obtainedby reacting the coumarin dimer component and the diamine component, thatis a diamine containing aromatic groups substituted with at least one OHgroup and further as desired other diamine components and/orsiloxane-containing diamines, and is usually obtained by effecting thereaction in a polar solvent such as N-methylpyrrolidone,dimethylacetoamide, γ-butylolactone and diglyme. The solvent usedtherefor is not particularly limited so long as the solvent is a solventcapable of dissolving the polyhydroxyamide resin (A). In addition, thelower limit of the temperature range for the reaction of the coumarindimer component and the diamine component is usually −20° C. or more,preferably −5° C. or more and the upper limit of the temperature rangeis usually 150° C. or less, preferably 100° C. or less. From the rangebetween the lower limit and the upper limit, any temperature can beselected.

(Compound (B) generating acid by light irradiation)

The compound (B) generating an acid by light irradiation which is usedin the present invention is not particularly limited so long as thecompound generates an acid through a photoreaction and enhances thesolubility of the light-irradiated part in an alkaline developer. Thesecompounds may be used singly or in combination of two or more typesthereof.

As the compound (B), any of conventionally known photoacid generatorsmay be adopted. Specific examples thereof include o-quinonediazidecompounds, allyl diazonium salts, diallyl iodonium salts, triallylsulfonium salts, o-nitrobenzyl esters, p-nitrobenzyl esters,trihalomethyl group-substituted s-triazine derivatives andimidesulfonate derivatives.

In addition, if necessary, a sensitizer can be used in combination withthe compound (B) generating an acid by light irradiation. Examples ofsuch a sensitizer include perylene, anthracene, thioxanthone, Michler'sketone, benzophenone and fluorene. However, the present invention is notlimited to these examples.

Among the compounds (B) generating an acid by light irradiation,o-quinonediazide compounds are preferred in terms of capable ofobtaining high sensitivity and high-resolution with respect to thecoating film obtained using the positive photosensitive resincomposition.

An o-quinonediazide compound is usually obtained by subjectingo-quinonediazidesulfonyl chloride and a compound having at least any onegroup selected from a hydroxy group and an amino group to a condensationreaction in the presence of a basic catalyst, as ano-quinonediazidesulfonate ester or an o-quinonediazidesulfonamide.

Examples of an o-quinonediazidesulfonic acid component constituting theo-quinonediazidesulfonyl chloride include1,2-naphthoquinone-2-diazide-4-sulfonic acid,1,2-naphthoquinone-2-diazide-5-sulfonic acid and1,2-naphthoquinone-2-diazide-6-sulfonic acid.

Examples of the compound having a hydroxy group include: phenolcompounds such as phenol, o-cresol, m-cresol, p-cresol, hydroquinone,resorcinol, catechol, o-methoxyphenol, 4,4-isopropylidenediphenol,1,1-bis(4-hydroxyphenyl)cyclohexane, 4,4′-dihydroxyphenylsulfone,4,4-hexafluoroisopropylidenediphenol,4,4′,4″-trihydroxytriphenylmethane, 1,1,1-tris(4-hydroxyphenyl)ethane,4,4′-(1-(4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl)ethylidene)bisphenol,methyl 3,4,5-trihydroxybenzoate, propyl 3,4,5-trihydroxybenzoate,isoamyl 3,4,5-trihydroxybenzoate ester, 2-ethylbutyl3,4,5-trihydroxybenzoate ester, 2,4-dihydroxybenzophenone,2,3,4-trihydroxybenzophenone, 2,2′,4,4′-tetrahydroxybenzophenone,2,3,4,4′-tetrahydroxybenzophenone, and2,3,4,2′,4′-pentahydroxybenzophenone; aliphatic alcohols such asethanol, 2-propanol, 4-butanol, cyclohexanol, ethylene glycol, propyleneglycol, diethylene glycol, dipropylene glycol, 2-methoxyethanol,2-butoxyethanol, 2-methoxypropanol, 2-butoxypropanol, ethyl lactate andbutyl lactate; anilines such as aniline, o-toluidine, m-toluidine,p-toluidine, 4-aminodiphenylmethane, 4-aminodiphenyl,o-phenylenediamine, m-phenylenediamine, p-phenylenediamine,4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylether; andaminocyclohexane.

Furthermore, examples of the compound having both of a hydroxy group andan amino group include: aminophenols such as o-aminophenol,m-aminophenol, p-aminophenol, 4-aminoresorcinol, 2,3-diaminophenol,2,4-diaminophenol, 4,4′-diamino-4″-hydroxytriphenylmethane,4-amino-4′,4″-dihydroxytriphenylmethane,bis(4-amino-3-carboxy-5-hydroxyphenyl)ether,bis(4-amino-3-carboxy-5-hydroxyphenyl)methane,bis(4-amino-3-carboxy-5-hydroxyphenyl)sulfone,2,2-bis(4-amino-3-carboxy-5-hydroxyphenyl)propane and2,2-bis(4-amino-3-carboxy-5-hydroxyphenyl)hexafluoropropane; andalkanolamines such as 2-aminoethanol, 3-aminopropanol and4-aminocyclohexanol.

By subjecting o-quinonediazidesulfonyl chloride and a compound having atleast one group selected from a hydroxy group and an amino group to acondensation reaction, there is obtained a di-substituted,tri-substituted, tetra-substituted or penta-substituted o-quinonediazidecompound in which a part or the whole of hydroxy groups or amino groupsof the above compound is replaced by an o-quinonediazidesulfonyl groupof o-quinonediazidesulfonyl chloride. When such an o-quinonediazidecompound is used as a component of the positive photosensitive resincomposition, generally used is the above poly-substitutedo-quinonediazide compound singly or as a mixture of two or more types ofpoly-substituted compounds selected from the above poly-substitutedcompounds.

Among the above o-quinonediazide compounds, from the viewpoint that thebalance of the difference between the development solubilities of theexposed part and the unexposed part with respect to the coating filmobtained using the positive photosensitive resin composition isfavorable, and that there is no development residue in a pattern bottompart (residue in a pattern edge part) during the development, preferredare o-quinonediazidesulfonate ester of p-cresol,o-quinonediazidesulfonate ester of4,4′-(1-(4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl)ethylidene)bisphenol, o-quinonediazidesulfonate ester of methyl3,4,5-trihydroxybenzoate ester, o-quinonediazidesulfonate ester of2,3,4-trihydroxybenzophenone and o-quinonediazidesulfonate ester of2,3,4,4′-tetrahydroxybenzophenone. These compounds may be used singly orin combination of two or more types arbitrarily selected from thesecompounds.

The content of the compound (B) generating an acid by light irradiationused in the present invention is not particularly limited. However, fromthe viewpoint that the difference in the solubility in a developerbetween the exposed part and the unexposed part with respect to thecoating film obtained from the positive photosensitive resin compositionof the present invention becomes higher, the content of the compound (B)is preferably 0.01 parts by mass or more, more preferably 10 parts bymass or more, based on 100 parts by mass of the polyhydroxyamide resin(A). In addition, from the viewpoint that the coating film obtainedusing the composition becomes to have high sensitivity and a cured filmobtained from the coating film also becomes to have excellent mechanicalproperties, the content of the compound (B) generating an acid by lightirradiation is preferably 100 parts by mass or less, more preferably 30parts by mass or less.

(Crosslinkable Compound (C))

The positive photosensitive resin composition of the present inventionmay contain a crosslinkable compound (C). The crosslinkable compound (C)is not particularly limited so long as it is a compound having a groupcapable of being reacted with an organic group contained in thepolyhydroxyamide resin (A) during a process (hereinafter, referred to asduring final-curing) for converting the coating film obtained using thepositive photosensitive resin composition to the cured film. Examples ofthe crosslinkable compound (C) include: compounds having two or moreepoxy groups; or melamine derivatives, benzoguanamine derivatives orglycoluril which have a group in which the hydrogen atom of an aminogroup is replaced by a methylol group, an alkoxymethyl group or both.These melamine derivatives and benzoguanamine derivatives may be adimer, a trimer or a mixture arbitrarily selected from monomers, dimersand trimers. As these melamine derivatives and benzoguanaminederivatives, preferred are those having methylol groups oralkoxymethylol groups in the number of three or more and less than sixin average per triazine ring.

In addition, the crosslinkable compound (C) of the present invention maybe used singly or in combination of two or more types thereof.

As the crosslinkable compound (C), commercially available compounds maybe used. Commercially available compounds are easily obtained, which ismore preferred. The followings are specific examples thereof (tradenames). However, the present invention is not limited to these examples.

Examples of the compounds having two or more epoxy groups include epoxycompounds having a cyclohexene structure such as Epolead GT-401, EpoleadGT-403, Epolead GT-301, Epolead GT-302, Celloxide 2021 and Celloxide3000 (manufactured by Daicel Chemical Industries, Ltd.); bisphenolA-type epoxy compounds such as Epikote 1001, Epikote 1002, Epikote 1003,Epikote 1004, Epikote 1007, Epikote 1009, Epikote 1010 and Epikote 828(manufactured by Japan Epoxy Resins Co., Ltd.); bisphenol F-type epoxycompounds such as Epikote 807 (manufactured by Japan Epoxy Resins Co.,Ltd.); phenol novolac-type epoxy compounds such as Epikote 152 andEpikote 154 (manufactured by Japan Epoxy Resins Co., Ltd.) and EPPN 201and EPPN 202 (manufactured by Nippon Kayaku Co., Ltd.); cresolnovolac-type epoxy compounds such as ECON-102, ECON-103S, ECON-104S,ECON-1020, ECON-1025 and ECON-1027 (manufactured by Nippon Kayaku Co.,Ltd.) and Epikote 180S75 (manufactured by Japan Epoxy Resins Co., Ltd.);alicyclic epoxy compounds such as Denacol EX-252 (manufactured by NagaseChemteX Corporation), CY175, CY177, CY179, Araldite CY-182, AralditeCY-192 and Araldite CY-184 (manufactured by CIBA-GEIGY A.G.), Epiclon200 and Epiclon 400 (manufactured by Dainippon Ink and Chemicals,Incorporated), Epikote 871 and Epikote 872 (manufactured by Japan EpoxyResins Co., Ltd.) and ED-5661 and ED-5662 (manufactured by CelaneseCoating Company); and aliphatic polyglycidylether compounds such asDenacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, DenacolEX-411, Denacol EX-512, Denacol EX-522, Denacol EX-421, Denacol EX-313,Denacol EX-314 and Denacol EX-312 (manufactured by Nagase ChemteXCorporation).

Examples of the melamine derivatives, the benzoguanamine derivative orthe glycourils which have a group in which the hydrogen atom of an aminogroup are replaced by a methylol group, an alkoxymethyl group or bothinclude MX-750 in which methoxymethyl groups are replaced in a number of3.7 in average per triazine ring and MW-30 in which methoxymethyl groupsare replaced in a number of 5.8 in average per triazine ring(manufactured by Sanwa Chemical Co., Ltd.); or methoxymethylatedmelamine such as Cymel 300, Cymel 301, Cymel 303, Cymel 350, Cymel 370,Cymel 771, Cymel 325, Cymel 327, Cymel 703 and Cymel 712;methoxymethylated butoxymethylated melamine such as Cymel 235, Cymel236, Cymel 238, Cymel 212, Cymel 253 and Cymel 254; butoxymethylatedmelamine such as Cymel 506 and Cymel 508; carboxyl group-containingmethoxymethylated isobutoxymethylated melamine such as Cymel 1141;methoxymethylated ethoxymethylated benzoguanamine such as Cymel 1123;methoxymethylated butoxymethylated benzoguanamine such as Cymel 1123-10;butoxymethylated benzoguanamine such as Cymel 1128; carboxylgroup-containing methoxymethylated ethoxymethylated benzoguanamine suchas Cymel 1125-80 (manufactured by Nihon Cytec Industries Inc. (former,Mitsui Cyanamide Co., Ltd.)); butoxymethylated glycouril such as Cymel1170; and methylolated glycoluril such as Cymel 1172.

In addition, as the crosslinkable compound (C), from the point thatthere is no film thickness loss of the coating film obtained using thepositive photosensitive resin composition of the present inventionduring the final curing and the point that the cured film obtained usingthe positive photosensitive resin composition is advantageous in heatresistance, chemical resistance and film density, epoxy compounds havingstructural units represented by Formula (21) and Formula (22):

(where R⁶⁴, R⁶⁵, R⁶⁶ and R⁶⁷ independently represent a hydrogen atom, ahydroxy group or an organic group having 1 to 10 carbon atom(s); and R⁶⁸represents an alkyl group having 1 to 4 carbon atom(s))and having two or more structural units represented by Formula (22) aremore preferred.

Specific examples of such an epoxy compound include commerciallyavailable products such as ECON-102, ECON-103S, ECON-104S, ECON-1020,ECON-1025 and ECON-1027 (manufactured by Nippon Kayaku Co., Ltd.) andEpikote 180S75 (manufactured by Japan Epoxy Resins Co., Ltd.) which fallunder a cresol novolac-type epoxy compound.

Among the above epoxy compounds, an epoxy compound having a numberaverage molecular weight of 500 to 10,000 is more preferred. When theepoxy compound has a number average molecular weight of less than 500,mechanical strength, heat resistance and chemical resistance of thecured film obtained using the positive photosensitive resin compositionof the present invention may be undermined. On the other hand, when theepoxy compound has a number average molecular weight of more than10,000, the compatibility of the epoxy compound with thepolyhydroxyamide resin (A) may be extremely lowered.

The content of the crosslinkable compound (C) in the positivephotosensitive resin composition of the present invention is notparticularly limited. However, since the water absorbing properties ofthe cured film obtained using the positive photosensitive resincomposition becomes lower and the heat resistance and the chemicalresistance thereof become higher, the content is preferably 1 part bymass or more, more preferably 5 parts by mass or more based on 100 partsby mass of the polyhydroxyamide resin (A). In addition, in terms of notundermining the preservation stability of the positive photosensitiveresin composition, the content of the crosslinkable compound (C) ispreferably 100 parts by mass or less, more preferably 50 parts by massor less based on 100 parts by mass of the polyhydroxyamide resin (A).

(Compound for Enhancing Adhesion)

The positive photosensitive resin composition of the present inventionmay contain an organic silane compound or an aluminum chelate compoundfor enhancing the adhesion of the coating film and the cured filmobtained using the composition to a substrate. As such an organic silanecompound and such an aluminum chelate compound, for example commerciallyavailable products manufactured by GE Toshiba Silicon Co., Ltd.,Shin-Etsu Chemical Co., Ltd., and the like may also be used and are morepreferred because such products are easily available.

Examples of the organic silane compound include vinyl triethoxy silane,3-glycidoxypropyl triethoxy silane, 3-glycidoxypropyl diethoxy silane,3-glycidoxypropyl ethoxydiethyl silane, 3-glycidoxypropyl trimethoxysilane, 3-glycidoxypropyl dimethoxymethyl silane, 3-glycidoxypropylmethoxydimethyl silane, 3-methacryloxypropyl trimethoxy silane,3-methacryloxypropyl methoxydimethyl silane, 3-methacryloxypropyldimethoxymethyl silane, 3-aminopropyl trimethoxy silane, 3-aminopropyldimethoxymethyl silane, 3-aminopropyl methoxydimethyl silane,3-aminopropyl triethoxy silane, 3-aminopropyl diethoxyethyl silane and3-aminopropyl ethoxydiethyl silane.

Examples of the aluminum chelate compound include tris(acetylacetonate)aluminum and acetylacetonate aluminum diisopropylate.

In the present invention, one type selected from the organic silanecompounds and the aluminum chelate compounds may be used singly or incombination of two or more types thereof.

Among them, 3-glycidoxypropyl triethoxy silane, 3-glycidoxypropyltrimethoxy silane and 3-aminopropyl triethoxy silane are more preferred.The content of a compound selected from the organic silane compounds andthe aluminum chelate compounds in the positive photosensitive resincomposition of the present invention is not particularly limited.However, from the viewpoint that the adhesion of the coating film andthe cured film obtained using the positive photosensitive resincomposition to a substrate can be satisfactorily enhanced, the contentis preferably 0.1 parts by mass or more, more preferably 0.5 parts bymass or more based on 100 parts by mass of the polyhydroxyamide resin(A). In addition, when the content of the compound selected from theorganic silane compounds and the aluminum chelate compounds is 30 partsby mass or less, the preservation stability of the positivephotosensitive resin composition is favorable and there is no residue inthe bottom part of a pattern obtained using the composition, which ispreferred and the content of 20 parts by mass or less is more preferred.

(Surfactant)

The positive photosensitive resin composition of the present inventionmay further contain a surfactant for enhancing the coating propertiesand the uniformity of the surface of the coating film formed by applyingthe composition. The surfactant used for this purpose is notparticularly limited and fluorinated surfactants, silicon-basedsurfactants, nonionic surfactants and the like may be used. As thesesurfactants, for example, commercially available products manufacturedby Sumitomo 3M Limited, Dainippon Ink and Chemicals, Incorporated, AsahiGlass Co., Ltd., and the like are preferred because such products areeasily available.

Among them, the fluorinated surfactant is preferred because thefluorinated surfactant has high enhancing effect of coating properties.More preferred examples of the fluorinated surfactant include EFTOPEF301, EFTOP EF303 and EFTOP EF352 (manufactured by JEMCO, Inc.),MEGAFAC F171, MEGAFAC F173 and MEGAFAC R-30 (manufactured by DainipponInk and Chemicals, Incorporated), Fluorad FC 430 and Fluorad FC431(manufactured by Sumitomo 3M Limited) and Asahi Guard AG 710, SurflonS-382, Surflon SC 101, Surflon SC 102, Surflon SC 103, Surflon SC 104,Surflon SC 105 and Surflon SC 106 (manufactured by Asahi Glass Co.,Ltd.).

The content of the surfactant used in the positive photosensitive resincomposition of the present invention is not particularly limited.However, when the content is less than 0.01 parts by mass based on 100parts by mass of the polyhydroxyamide resin (A), the enhancing effect ofthe coating properties may not be obtained. Therefore, the content ofthe surfactant is preferably 0.01 parts by mass or more, more preferably0.05 parts by mass or more based on 100 parts by mass of thepolyhydroxyamide resin (A). On the other hand, when the content of thesurfactant is more than 15 parts by mass based on 100 parts by mass ofthe polyhydroxyamide resin (A), the uniformity of the surface of thecoating film may not be obtained. Therefore, the content of thesurfactant is preferably 15 parts by mass or less, more preferably 10parts by mass or less based on 100 parts by mass of the polyhydroxyamideresin (A).

(Organic Solvent)

The positive photosensitive resin composition of the present inventionis usually dissolved in an organic solvent to be used in a varnish form.The organic solvent used in a varnish containing the positivephotosensitive resin composition of the present invention is notparticularly limited so long as the solvent can homogeneously dissolvethe polyhydroxyamide resin (A), the compound (B) generating an acid bylight irradiation, the crosslinkable compound (C) blended if necessary,the compound for enhancing the adhesion, the surfactant or the like, andthese components can be compatibilized with each other in the solvent.

Specific examples of the organic solvent include acetone, methanol,ethanol, isopropyl alcohol, methoxymethyl pentanol, dipentene, ethylamyl ketone, methyl nonyl ketone, methyl ethyl ketone, methyl isoamylketone, methyl isopropyl ketone, methyl cellosolve, ethyl cellosolve,butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate,butyl carbitol, butyl carbitol acetate, ethyl carbitol, ethyl carbitolacetate, ethylene glycol, ethylene glycol monoacetate, ethylene glycolmonoisopropyl ether, ethylene glycol monobutyl ether, propylene glycol,propylene glycol monoacetate, propylene glycol monomethyl ether,propylene glycol monomethyl ether acetate, propylene glycol tert-butylether, diethylene glycol, diethylene glycol monoacetate, diethyleneglycol dimethyl ether, dipropylene glycol monoacetate monomethyl ether,dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether,dipropylene glycol monoacetate monoethyl ether, dipropylene glycolmonopropyl ether, dipropylene glycol monopropyl ether acetate,3-methyl-3-methoxybutyl acetate, tripropylene glycol methyl ether,3-methyl-3-methoxybutanol, diisopropyl ether, ethyl isobutyl ether,diisobutylene, amyl acetate, butyl butylate, butyl ether, diisobutylketone, methylcyclohexene, propyl ether, dihexyl ether, dioxane,N,N-dimethylacetamide, N,N-dimethylformamide, N-methyl-2-pyrrolidone,N-vinyl pyrrolidone, dimethyl sulfoxide, N-methylpyrrolidone,γ-butyrolactone, n-hexane, n-pentane, n-octane, 2-methoxyethanol,2-ethoxyethanol, 2-butoxyethanol, diethyl ether, cyclohexanone, methyllactate, ethyl lactate, butyl lactate, methyl acetate, ethyl acetate,n-butyl acetate, propylene glycol acetate monoethyl ether, methylpyruvate, ethyl pyruvate, methyl 3-methoxypropionate, methyl3-ethoxypropionate, methyl 3-methoxypropionate, 3-ethoxypropionic acid,3-methoxypropionic acid, propyl 3-methoxypropionate, butyl3-methoxypropionate and diglyme.

These organic solvents may be used singly or in an appropriatecombination of two or more types thereof.

Among them, in terms of being easily handled for the positivephotosensitive resin composition, as the organic solvent, preferred isone type or a mixture of two or more types selected from methyl ethylketone, butylcellosolve, propylene glycol monomethyl ether, propyleneglycol monomethyl ether acetate, dipropylene glycol monomethyl ether,N,N-dimethylacetoamide, N-methylpyrrolidone, γ-butylolactone, ethyllactate, and butyl lactate.

(Positive Photosensitive Resin Composition)

The method for obtaining the positive photosensitive resin compositionof the present invention is not particularly limited. Since acomposition of this type is usually used in a varnish form, the positivephotosensitive resin composition of the present invention is generallyprepared by dissolving the polyhydroxyamide resin (A), the compound (B)generating an acid by light irradiation, and, as desired othercomponents such as the crosslinkable compound (C), in an organicsolvent.

At this time, for example, a coumarin dimer component and a diaminecomponent as monomers constituting the polyhydroxyamide resin (A) may besubjected to a polymerization reaction in an organic solvent and theobtained reaction solution may be used as it is.

In addition, when a plurality of types of organic solvents is used, aplurality of types of organic solvents may be mixed before use, or maybe separately added as appropriate.

The concentration of the solid content in the positive photosensitiveresin composition of the present invention is not particularly limitedso long as each component is homogeneously dissolved. Generally, when asolution of the positive photosensitive resin composition is used at asolid content concentration arbitrarily selected from a range of solidcontent concentration of 1% to 50% by mass, the coating film can beeasily formed.

(Coating Film and Cured Film)

Generally, the coating film containing the positive photosensitive resincomposition of the present invention can be formed, for example, byapplying the positive photosensitive resin composition of the presentinvention on a silicon wafer, a glass plate, a ceramic substrate, or asubstrate having an oxide film or a nitride film, using a known methodsuch as spin-coating, immersing, and printing, and then pre-drying thecomposition at a temperature of 60° C. to 160° C., preferably 70° C. to130° C.

After the formation of the coating film, the coating film is exposed toan ultraviolet (UV) ray or the like using a mask having a predeterminedpattern, and the film is developed with an alkaline developer to washaway an exposed part. As a result of this, a relief pattern having asharp (distinct) edge face is formed on a substrate. The developer usedin this process is not particularly limited so long as the developer isan alkaline aqueous solution, and examples thereof include an aqueoussolution of an alkali metal hydroxide such as potassium hydroxide,sodium hydroxide, potassium carbonate and sodium carbonate; an aqueoussolution of quaternary ammonium hydroxide such as tetramethylammoniumhydroxide, tetraethylammonium hydroxide and choline; and an aqueoussolution of amine such as ethanolamine, propylamine and ethylenediamine.

As the alkaline developer, generally an alkaline aqueous solution of 10%by mass or less is used, and industrially, an alkaline aqueous solutionof 0.1% to 3.0% by mass is used. In addition, the alkaline developer maycontain alcohols, a surfactant, or the like, preferably in an amount ofaround 0.05% to 10% by mass.

In the developing process, the temperature of the alkaline developer canbe arbitrarily selected. However, when the positive photosensitive resincomposition of the present invention is used, the solubility of anexposed part is high, so that the development using the alkalinedeveloper can be easily performed at room temperature.

Thus, by subjecting the obtained substrate having the relief pattern toa heating treatment (calcination) at a temperature of 180° C. to 400°C., the cured film can be formed with the relief pattern, havingexcellent electric properties due to low water absorbing properties, andfavorable heat resistance and chemical resistance.

Since the cured film obtained from the positive photosensitive resincomposition of the present invention has such advantageous effects, thefilm can be used in electric/electronic devices, semiconductor devices,display devices and the like.

Particularly, since the cured film obtained from the positivephotosensitive resin composition of the present invention has such acharacteristic effect that the cured film contains no inorganic ion, itis very useful in an insulating film and a diaphragm material for anorganic electroluminescent (EL) element or a light-emitting diode (LED),in which a damage of a light-emitting element caused by inorganic ionsbecomes a serious problem, or in a buffer coating largely affected bythe presence or absence of ion-migration of inorganic ions in a copperwiring in a semiconductor package.

EXAMPLES

Hereinafter, the present invention will be described in more detailreferring to Examples. However, the present invention is not limited tothese examples.

Abbreviations Used in Examples

The meanings of the abbreviations used in Examples are as follows.

(Solvent)

PGME: propylene glycol monomethyl ether

NMP: N-methylpyrrolidone

DMAc: N,N′-dimethylacetamide

(Amines)

BAHF: 2,2′-bis(3-amino-4-hydroxyphenyl)hexafluoropropaneBAPF: bis(3-amino-4-hydroxyphenyl)methaneAHPK: 3,3′-diamino-4,4′-dihydroxybenzophenoneAHPE: 3,3′-diamino-4,4′-dihydroxy-phenyletherBAPA: 2,2′-bis(3-amino-4-hydroxyphenyl)propaneAHPA: (3-amino-4-hydroxy)phenyl (3-amino-4-hydroxy)anilideBSDA: bis(3-amino-4-hydroxyphenyl)sulfideAPDS: bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxaneODA: 4,4′-diaminodiphenyletherDA4P: 1,3-bis(4-aminophenoxy)benzeneABA: 4-aminobenzylamineDHCM: 4,4′-diamino-3,3′-dimethylcyclohexylmethane

(Ester Cyclized Product)

CD: coumarin dimer

(Photosensitizer and Others)

P200: (manufactured by Toyo Gosei Co., Ltd.; trade name: P-200; aphotosensitizer synthesized by a condensation reaction of 1 mol of4,4′-(1-(4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl)ethylidene)bisphenoland 2 mol of 1,2-naphthoquinone-2-diazide-5-sulfonyl chloride)TMAH: 2.38% by weight tetramethylammonium hydroxide aqueous solution

(Measurement of Number Average Molecular Weight and Weight AverageMolecular Weight)

The weight average molecular weight (hereinafter, abbreviated as Mw) andthe molecular weight distribution of the polymer were measured using aGPC device (Shodex (registered trademark) column KF803L and KF805L;manufactured by JASCO Corporation) under a condition thatdimethylformamide as an eluting solvent was flowed at a flow rate of 1ml/minute at a column temperature of 50° C. Here, Mw is represented as apolystyrene converted value.

Synthesis Example Synthesis Example Synthesis of Polyhydroxyamide (P1)

1.12 g (0.0056 mol) of ODA, 0.51 g (0.0014 mol) of BAHF and 2.05 g(0.007 mol) of CD were dissolved in 13.5 g of NMP, and the reaction waseffected at 100° C. for 24 hours. Mw and the molecular weightdistribution of the obtained polymer were found to be 15,000 and 1.96,respectively. In addition, 1.00 g of the obtained polymer solution wastransferred into an aluminum cup and was heated on a hot plate at 200°C. for 2 hours to calculate the solid content. The calculated solidcontent was 19.91% by weight. The obtained polymer was soluble in TMAH.

Synthesis Example Synthesis of Polyhydroxyamides (P2 to P10)

In substantially the same manner as in Synthesis Example 1, variousdiamines and ester cyclized products were reacted in a solvent tosynthesize polymers. The type and the amount used of diamines, estercyclized products and solvents which were used in the reaction, Mw andmolecular weight distribution of the obtained polymers, and the solidcontent are shown in Table 1. The obtained polymers were soluble inTMAH.

Comparative Synthesis Example Synthesis of Polyhydroxyamide (H1)

1.00 g (0.005 mol) of ODA and 1.62 g (0.005 mol) of CD were dissolved in10.49 g of DMAc and the reaction was effected at 90° C. for 24 hours. Mwand the molecular weight distribution of the obtained polymer were foundto be 7,000 and 1.73, respectively. In addition, 1.00 g of the obtainedpolymer solution was transferred into an aluminum cup and was heated ona hot plate at 200° C. for 2 hours to calculate the solid content. Thecalculated solid content was 20.93% by weight. The obtained polymer wassoluble in TMAH.

Comparative Synthesis Example Synthesis of Polyhydroxyamides (H2 and H3)

In substantially the same manner as in Comparative Example 1, variousdiamines and ester cyclized products were reacted in a solvent tosynthesize polymers. The type and amount used of diamines, estercyclized products and solvents which were used in the reaction, Mw andmolecular weight distribution of the obtained polymers, and the solidcontent are shown in Table 1. Here, the obtained polymers were insolublein TMAH, so that the polymers were not used in the subsequentpreparation and evaluation of positive photosensitive resincompositions.

TABLE 1 Polymer composition and molecular weight Polymer composition (g)Ester Molecular Molecular weight Polymer cyclized Solvent weightdistribution Solid content solution product Diamine 1 Diamine 2 Diamine3 used (g) (Mw) (Mw/Mn) (%) P1 CD ODA BAHF — NMP 15,000 1.96 20.93(2.05) (1.12) (0.51) (13.5) P2 CD ODA BAHF APDS NMP 3,100 1.52 19.99(1.76) (0.60) (0.59) (0.149) (12.4) P3 CD ODA BAPF — NMP 2,000 1.3320.01 (1.76) (0.72) (0.55) (12.2) P4 CD ODA AHPK — NMP 4,100 1.69 19.99(1.76) (0.72) (0.59) (12.2) P5 CD ODA AHPE — NMP 4,000 1.97 19.98 (1.76)(0.72) (0.56) (12.1) P6 CD AHPE — — NMP 5,200 1.75 29.95 (1.76) (1.38) (7.51) P7 CD BAPA — — NMP 4,900 1.57 29.99 (1.76) (1.20)  (6.89) P8 CDAHPA — — NMP 5,400 1.58 29.93 (1.76) (1.56)  (7.72) P9 CD ODA BSDA — NMP4,000 1.58 19.93 (2.05) (1.43) (0.58) (16.3) P10 CD DA4P BAHF — NMP3,600 1.59 19.96 (2.05) (1.22) (1.02) (17.1) H1 CD ODA — — DMAc 13,3001.33 19.99 (1.46) (1.00)  (9.85) H2 CD DHCM — — DMAc 37,000 1.80 23.68(1.46) (1.83) (10.6) H3 CD ABA — — NMP 4,600 1.74 19.91 (1.46)  (0.610) (8.29)

(Preparation of Positive Photosensitive Resin Composition)

In the compositions shown in Table 2, polymer solutions (P1 to P10 andH1), a photosensitizer (P200) and 0.0002 g of a fluorinated surfactant(manufactured by Dainippon Ink and Chemicals, Incorporated; MEGAFACR-30) were mixed and the resultant mixture was stirred at roomtemperature for 3 hours or more to prepare positive photosensitive resincompositions.

TABLE 2 Varnish composition Polymer solution Photoensitizer Polymer(amount (P200) Solvent added No. solution used (g)) (amount used (g))(type: amount (g)) Example 1 P1 4.0 0.398 PGME: 3.03 Example 2 P2 3.50.350 PGME: 2.29 Example 3 P3 3.5 0.350 PGME: 2.29 Example 4 P4 3.50.350 PGME: 2.29 Example 5 P5 3.5 0.351 PGME: 2.29 Example 6 P6 3.00.448 PGME: 2.29 Example 7 P7 3.0 0.448 NMP: 4.45 Example 8 P8 3.0 0.446NMP: 4.45 Example 9 P9 4.0 0.399 PGME: 2.62 Example 10 P10 3.5 0.350PGME: 2.30 Comparative H1 4.0 0.401 PGME: 3.03 Example 1

(Development Evaluation)

The positive photosensitive resin compositions obtained according toTable 2 were evaluated by the following methods. The used developingconditions and the evaluation results are shown in Table 3.

(Production of Coating Film in which Pattern is Formed)

The positive photosensitive resin compositions of Examples 1 to 10 andComparative Example 1 were applied on indium tin oxide (ITO) substrates(manufactured by Sanyo Vacuum Industries Co., Ltd.) having a step partof 50 mm×50 mm using a spin coater. Subsequently, the compositions wereprebaked on a hot plate at a temperature of 100° C. for 120 seconds toform coating films. The film thickness at this time is shown in Table 3as “film thickness before curing”. Here, for the measurement of the filmthickness, a contact film thickness measuring apparatus (Dektak 3ST;manufactured by ULVAC, Inc.) was used.

A UV light was irradiated to the obtained coating films by anultraviolet irradiation device (PLA-600; manufactured by Cannon Inc.)through a test mark of line/space, on which 1/1 to 100/100 aredescribed, for 16 seconds (100 mJ/cm²). After the exposure, the coatingfilms were immersed in 2.38% by weight TMAH and developed, and thensubjected to a cleaning process using pure water for 20 seconds toobtain coating films in which patterns are formed. At this time, thetime for the development was employed as shown in Table 3 in eachExample and Comparative Example as developing time.

Then, the film thickness of an unexposed part after the development wasmeasured by the above contact film thickness measuring apparatus. Themeasured film thickness is shown in Table 3 as “film thickness afterdevelopment”.

(Resolution)

The coating film after the development was observed by a microscope toconfirm the minimum line/space size of the obtained pattern. The patternsize is shown in Table 3.

TABLE 3 Development evaluation Film thickness Film thickness beforecuring Developing time after development Pattern size Developing No.(μm) (second) (μm) (μm) properties* Example 1 0.716 30 0.699 20 AExample 2 1.031 20 1.030 10 A Example 3 1.533 20 0.836 10 A Example 41.305 10 0.933 20 B Example 5 1.181 20 0.853 20 B Example 6 3.699 301.107 40 C Example 7 2.052 10 0.683 50 C Example 8 1.670 10 0.591 50 CExample 9 1.261 50 1.260 10 A Example 10 1.042 40 1.040 10 A Comparative0.722 40 0.726 — D Example 1 *Evaluation of developing properties: A:Positive pattern of 10 μm or less can be formed. B: Positive pattern ofaround 10 μm to 20 μm can be formed. C: Positive pattern of around 20 μmto 50 μm can be formed. D: Exposed part cannot be entirely removed, sothat the pattern formation is impossible.

In Examples 1 to 10, in the exposed part, there was no developmentresidue of the pattern bottom part (residue in the pattern edge part)and all advantageous positive patterns were obtained.

On the other hand, in Comparative Example 1, although a film thicknessloss in the unexposed part was not observed, in the pattern bottom partof the exposed part, there were observed many development residues, sothat the pattern formation was failed.

1. A positive photosensitive resin composition comprising: at least onetype of a polyhydroxyamide resin (A) containing a repeating unitrepresented by Formula (1):

(where X represents a tetravalent aliphatic group or an aromatic group;R¹ and R² independently represent a hydrogen atom or an alkyl grouphaving 1 to 10 carbon atom(s); Ar¹ and Ar² independently represent anaromatic group; Y represents an organic group containing an aromaticgroup substituted with at least one OH group; n represents an integer of1 or more; and l and m independently represent an integer of 0 or 1 ormore and satisfy l+m≦2) and having a weight average molecular weight of3,000 to 100,000; and a compound (B) generating an acid by lightirradiation. 2.-4. (canceled)
 5. The positive photosensitive resincomposition according to claim 1, wherein in Formula (1), a group:

has a structure represented by Formula (2):

(where Ar¹, Ar², Y, l and m represent the same meaning as defined above;and R³ to R⁶ independently represent a hydrogen atom or an alkyl grouphaving 1 to 10 carbon atom(s)).
 6. The positive photosensitive resincomposition according to claim 1, wherein the Ar¹ and the Ar²independently represent a benzene ring.
 7. The positive photosensitiveresin composition according to claim 6, wherein the —Ar¹(OH), group andthe —Ar²(OH)_(m) group have a structure represented by Formula (3):

(where R⁷ to R¹⁰ independently represent a hydrogen atom, an alkyl grouphaving 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbonatom(s), an alkoxy group having 1 to 10 carbon atom(s), a halogen atom,a nitro group, a formyl group, a cyano group, a carboxyl group, aphosphonyl group, a sulfonyl group, a phenyl group which is optionallysubstituted with W¹, a naphthyl group which is optionally substitutedwith W¹, a thienyl group which is optionally substituted with W¹ or afuryl group which is optionally substituted with W¹; and W¹ representsan alkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1to 10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), ahydroxy group, a halogen atom, a nitro group, a formyl group, a cyanogroup, a carboxyl group, a phosphonyl group or a sulfonyl group).
 8. Thepositive photosensitive resin composition according to claim 1, whereinthe Y represents an organic group containing a benzene ring substitutedwith at least one OH group.
 9. The positive photosensitive resincomposition according to claim 8, wherein the Y represents an organicgroup containing two or more benzene rings substituted with at least oneOH group.
 10. The positive photosensitive resin composition according toclaim 9, wherein the Y has a structure represented by Formula (4):

(where R¹¹ to R¹⁶ independently represent a hydrogen atom, an alkylgroup having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a hydroxygroup, a halogen atom, a nitro group, a formyl group, a cyano group, acarboxyl group, a phosphonyl group, a sulfonyl group, a phenyl groupwhich is optionally substituted with W², a naphthyl group which isoptionally substituted with W², a thienyl group which is optionallysubstituted with W² or a furyl group which is optionally substitutedwith W²; W² represents an alkyl group having 1 to 10 carbon atom(s), ahaloalkyl group having 1 to 10 carbon atom(s), an alkoxy group having 1to 10 carbon atom(s), a hydroxy group, a halogen atom, a nitro group, aformyl group, a cyano group, a carboxyl group, a phosphonyl group or asulfonyl group; Z¹ represents a single bond, an alkylene group having 1to 10 carbon atom(s) which is optionally substituted with W³, —C(O)O—,—C(O)NH—, —O—, —S—, —S(O)₂— or —C(O)—; and W³ represents an alkyl grouphaving 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbonatom(s) or an alkoxy group having 1 to 10 carbon atom(s)). 11.(canceled)
 12. The positive photosensitive resin composition accordingto claim 1, wherein the polyhydroxyamide resin further contains at leastone type of a repeating unit represented by Formula (5):

(where X, Ar¹, Ar², R¹, R², l and m represent the same meaning asdefined above; Q represents a divalent organic group (with a provisothat the group contains no OH group); and p represents an integer of 1or more). 13.-20. (canceled)
 21. The positive photosensitive resincomposition according to claim 1, wherein the polyhydroxyamide resinfurther contains at least one type of a repeating unit represented byFormula (9):

(where X, Ar¹, Ar², R¹, R², l and m represent the same meaning asdefined above; R⁵² to R⁵⁶ independently represent a hydrogen atom, analkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), ahalogen atom, a nitro group, a formyl group, a cyano group, a carboxylgroup, a phosphonyl group, a sulfonyl group, a phenyl group which isoptionally substituted with W⁶, a naphthyl group which is optionallysubstituted with W⁶, a thienyl group which is optionally substitutedwith W⁶ or a furyl group which is optionally substituted with W⁶; W⁶represents an alkyl group having 1 to 10 carbon atom(s), a haloalkylgroup having 1 to 10 carbon atom(s); an alkoxy group having 1 to 10carbon atom(s), a hydroxy group, a halogen atom, a nitro group, a formylgroup, a cyano group, a carboxyl group, a phosphonyl group or a sulfonylgroup; Z⁸ to Z¹⁰ independently represent a single bond, an alkylenegroup having 1 to 10 carbon atom(s) which is optionally substituted withW⁷, —C(O)O—, —C(O)NH—, —O—, —S—, —S(O)₂— or —C(O)—; W⁷ represents analkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to10 carbon atom(s) or an alkoxy group having 1 to 10 carbon atom(s); andq represents an integer of 1 or more). 22.-26. (canceled)
 27. A positivephotosensitive resin composition-containing varnish wherein the positivephotosensitive resin composition according to claim 1 is dissolved in atleast one type of a solvent.
 28. A cured film produced by using thepositive photosensitive resin composition according to claim
 1. 29. Acured film produced by using the positive photosensitive resincomposition-containing varnish according to claim
 27. 30. A structurecomprising: at least one layer formed by the cured film according toclaim 28 on a substrate.
 31. A polyhydroxyamide resin containing arepeating unit represented by Formula (10):

(where X represents a tetravalent aliphatic group or an aromatic group;R¹ and R² independently represent a hydrogen atom or an alkyl grouphaving 1 to 10 carbon atom(s); Ar¹ and Ar² independently represent anaromatic group; Y represents an organic group containing an aromaticgroup substituted with at least one OH group; n represents an integer of1 or more; and l and m independently represent an integer of 0 or 1 ormore and satisfy l+m≦2), and having a weight average molecular weight of3,000 to 100,000. 32.-53. (canceled)